Apple commits $30 billion to Broadcom for U.S. chip deal

The agreement, which Apple announced Wednesday, commits more than $30 billion to Broadcom over multiple years to develop custom silicon and next-generation wireless connectivity components destined for Apple devices. According to Apple, U.S.

facilities will turn out upward of 15 billion chips under the arrangement, a volume the company says will sustain hundreds of American jobs. Broadcom has pledged $1.5 billion toward upgrading and enlarging its Fort Collins, Colorado plant, which will serve as the production hub for radio frequency components — among them FBAR filters — and wireless connectivity technologies.

The company characterized the Broadcom deal as the single biggest commitment it has made through its American Manufacturing Program, an initiative introduced in 2025 with the goal of building out domestic production capacity throughout its supplier network. "Apple and Broadcom have a long history together, and this new phase of our partnership further accelerates our commitment to American manufacturing and innovation," Apple CEO Tim Cook said in a statement. "We're grateful to the president and his administration for supporting important projects like this one."

For its part, Broadcom Chief Executive Hock Tan described the financial backing from Apple as what will make it possible for the chipmaker to grow its presence in Fort Collins. A regulatory filing Broadcom submitted to the Securities and Exchange Commission earlier this week revealed that the two companies had signed new long-term contracts — running until 2031 — covering the development and supply of custom ASIC silicon products across several future generations of Apple hardware. Apple said the spending fits within its broader, previously disclosed pledge to channel $600 billion into the U.

S. economy across four years. The deal builds on a long-standing supply relationship between the two companies, under which Broadcom has provided Apple with custom radio frequency chips for cellular connectivity in iPhones as well as semiconductors handling Wi-Fi, Bluetooth, and other networking functions.

Apple has been developing its own modem technology — its C1 chip debuted in the iPhone 16E — but has not been able to move away from Broadcom for wireless and radio frequency components. Broadcom's partnership with Apple comes as the chipmaker has been expanding its custom chip work across the technology industry. As Quartz reported on Broadcom's second-quarter earnings, the company's AI chip revenue reached $10.

8 billion in that quarter, a 143% increase from a year earlier, with the company targeting AI semiconductor revenue in excess of $100 billion for the full fiscal year. The agreement, which Apple announced Wednesday, commits more than $30 billion to Broadcom over multiple years to develop custom silicon and next-generation wireless connectivity components destined for Apple devices. According to Apple, U.

S. facilities will turn out upward of 15 billion chips under the arrangement, a volume the company says will sustain hundreds of American jobs. Broadcom has pledged $1.

5 billion toward upgrading and enlarging its Fort Collins, Colorado plant, which will serve as the production hub for radio frequency components — among them FBAR filters — and wireless connectivity technologies. The company characterized the Broadcom deal as the single biggest commitment it has made through its American Manufacturing Program, an initiative introduced in 2025 with the goal of building out domestic production capacity throughout its supplier network. "Apple and Broadcom have a long history together, and this new phase of our partnership further accelerates our commitment to American manufacturing and innovation," Apple CEO Tim Cook said in a statement.

"We're grateful to the president and his administration for supporting important projects like this one." For its part, Broadcom Chief Executive Hock Tan described the financial backing from Apple as what will make it possible for the chipmaker to grow its presence in Fort Collins. A regulatory filing Broadcom submitted to the Securities and Exchange Commission earlier this week revealed that the two companies had signed new long-term contracts — running until 2031 — covering the development and supply of custom ASIC silicon products across several future generations of Apple hardware.

Apple said the spending fits within its broader, previously disclosed pledge to channel $600 billion into the U.S. economy across four years.

The deal builds on a long-standing supply relationship between the two companies, under which Broadcom has provided Apple with custom radio frequency chips for cellular connectivity in iPhones as well as semiconductors handling Wi-Fi, Bluetooth, and other networking functions. Apple has been developing its own modem technology — its C1 chip debuted in the iPhone 16E — but has not been able to move away from Broadcom for wireless and radio frequency components. Broadcom's partnership with Apple c